17th Electronic Circuits World Convention
Interconnection Technology for the AI-Driven Future
PCB, Substrate & Advanced Packaging
18–20 August 2027, BITEC, Bangkok, Thailand
A premier global platform connecting electronics industry leaders, researchers, engineers, policymakers and international associations across the PCB, PCBA, EMS, IC substrate, semiconductor packaging and advanced electronics ecosystem.
About ECWC17
Advancing the future of electronic interconnection
The Electronic Circuits World Convention is a global conference organized within the framework of the World Electronic Circuits Council. It brings together international associations, industry executives, engineers, researchers, academics and policymakers across printed circuit boards, printed circuit board assembly, electronics manufacturing services, IC substrates, semiconductor packaging and advanced electronics technologies.
ECWC17 will be hosted in Thailand by the Thailand Printed Circuit Association, with Mahanakorn University of Technology as the conference partner. Held alongside Thailand Electronics Circuit Asia 2027, the convention will create an integrated environment for technical exchange, investment dialogue, industrial collaboration and workforce development.
Event information
Strategic objectives
Why ECWC17 matters
The convention connects advanced technical knowledge with industrial priorities and long-term international collaboration.
Global Knowledge Exchange
Share research, manufacturing expertise, market insight and technology roadmaps across regions.
Industrial Innovation
Accelerate adoption of advanced PCB, substrate, packaging, automation and quality technologies.
International Collaboration
Strengthen relationships among WECC associations, government, academia and industry.
Workforce Development
Develop future engineering capability through student engagement, skills programs and university networks.
Who should attend
The Global Electronics Ecosystem
ECWC17 is designed for technical, commercial, academic and policy stakeholders throughout the electronics value chain.
Industry
PCB and substrate manufacturers, semiconductor packaging companies, EMS and PCBA providers, materials suppliers, equipment companies, testing specialists and technology solution providers.
Research & Academia
Researchers, professors, students, technical institutes, standards organizations and university–industry collaboration teams.
Policy & Investment
Government agencies, investment promotion organizations, industry associations, policymakers and international delegations.
ECWC17 at a glance
Connecting global expertise with industrial impact
A three-day technical convention supported by keynote sessions, industry dialogue, student activities, awards, networking and the co-located THECA 2027 exhibition.
Technical Conference
Eight technical tracks featuring oral presentations, poster sessions and high-quality research and industry innovation.
Keynote Sessions
Perspectives from global industry leaders and technology visionaries on market direction, emerging technologies and future opportunities.
THECA 2027 Exhibition
Direct access to the regional exhibition platform for PCB, substrate, PCBA, EMS and advanced electronics manufacturing.
Student Activities
Student paper competition, technical forum and university networking to support the next generation of engineers.
Awards
Recognition for outstanding papers, young engineers and student contributions to electronics technology and innovation.
Global Networking
Welcome reception, networking luncheon, gala dinner and curated opportunities to build international partnerships.
Important dates
Plan your ECWC17 participation
The technical program timeline is under development. Dates should be updated after approval by the Technical Program Committee.
| Milestone | Date | Status |
|---|---|---|
| Call for Papers Opens | 15 SEP 2026 | Confirmed |
| Abstract Submission Deadline | 1 FEB 2027 | Confirmed |
| Full Paper Submission Deadline | 23 APR 2027 | Confirmed |
| Decision Notification | 18 JUN 2027 | Confirmed |
| Revised Paper Submission & Final Acceptance | 9–16 JUL 2027 | Confirmed |
| Early-bird Registration Deadline | 23 JUL 2027 | Confirmed |
| Final Technical Programme Published | 30 JUL 2027 | Confirmed |
| Presentation Slides Submission Deadline | 6 AUG 2027 | Confirmed |
| ECWC17 Conference | 18–20 August 2027 | Confirmed |
Partnership opportunities
Position your brand at the centre of the global electronics community
ECWC17 sponsorship provides global brand exposure, access to decision-makers and opportunities to showcase industry leadership through conference, exhibition and networking channels.
The 17th Electronic Circuits World Convention,
bringing together the global electronics ecosystem
for knowledge exchange, innovation and collaboration.
Explore
Conference Secretariat
info@thpca.org
+66 89 987 9701
+66 89 699 4884
Bangkok, Thailand
© 2027 ECWC17. All rights reserved.
Organized by THPCA · Conference powered by MUT · Co-located with THECA 2027