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17th Electronic Circuits World Convention

Interconnection Technology for the AI-Driven Future

PCB, Substrate & Advanced Packaging

18–20 August 2027, BITEC, Bangkok, Thailand

A premier global platform connecting electronics industry leaders, researchers, engineers, policymakers and international associations across the PCB, PCBA, EMS, IC substrate, semiconductor packaging and advanced electronics ecosystem.

About ECWC17

Advancing the future of electronic interconnection

The Electronic Circuits World Convention is a global conference organized within the framework of the World Electronic Circuits Council. It brings together international associations, industry executives, engineers, researchers, academics and policymakers across printed circuit boards, printed circuit board assembly, electronics manufacturing services, IC substrates, semiconductor packaging and advanced electronics technologies.

ECWC17 will be hosted in Thailand by the Thailand Printed Circuit Association, with Mahanakorn University of Technology as the conference partner. Held alongside Thailand Electronics Circuit Asia 2027, the convention will create an integrated environment for technical exchange, investment dialogue, industrial collaboration and workforce development.

Event information

Event
17th Electronic Circuits World Convention (ECWC17)
 
Date
18–20 August 2027
 
Venue
BITEC, Bangkok, Thailand
 
Theme
Interconnection Technology for the AI-Driven Future: PCB, Substrate & Advanced Packaging
 
Co-located event
Thailand Electronics Circuit Asia 2027

Strategic objectives

Why ECWC17 matters

The convention connects advanced technical knowledge with industrial priorities and long-term international collaboration.

Global Knowledge Exchange

Share research, manufacturing expertise, market insight and technology roadmaps across regions.

Industrial Innovation

Accelerate adoption of advanced PCB, substrate, packaging, automation and quality technologies.

International Collaboration

Strengthen relationships among WECC associations, government, academia and industry.

Workforce Development

Develop future engineering capability through student engagement, skills programs and university networks.

Who should attend

The Global Electronics Ecosystem

ECWC17 is designed for technical, commercial, academic and policy stakeholders throughout the electronics value chain.

Industry

PCB and substrate manufacturers, semiconductor packaging companies, EMS and PCBA providers, materials suppliers, equipment companies, testing specialists and technology solution providers.

Research & Academia

Researchers, professors, students, technical institutes, standards organizations and university–industry collaboration teams.

Policy & Investment

Government agencies, investment promotion organizations, industry associations, policymakers and international delegations.

ECWC17 at a glance

Connecting global expertise with industrial impact

A three-day technical convention supported by keynote sessions, industry dialogue, student activities, awards, networking and the co-located THECA 2027 exhibition.

Technical Conference

Eight technical tracks featuring oral presentations, poster sessions and high-quality research and industry innovation.

Keynote Sessions

Perspectives from global industry leaders and technology visionaries on market direction, emerging technologies and future opportunities.

THECA 2027 Exhibition

Direct access to the regional exhibition platform for PCB, substrate, PCBA, EMS and advanced electronics manufacturing.

Student Activities

Student paper competition, technical forum and university networking to support the next generation of engineers.

Awards

Recognition for outstanding papers, young engineers and student contributions to electronics technology and innovation.

Global Networking

Welcome reception, networking luncheon, gala dinner and curated opportunities to build international partnerships.

Important dates

Plan your ECWC17 participation

The technical program timeline is under development. Dates should be updated after approval by the Technical Program Committee.

Conference Milestones
Milestone Date Status
Call for Papers Opens To be announced TBA
Abstract / Paper Submission Deadline To be announced TBA
Acceptance Notification To be announced TBA
Camera-Ready Submission To be announced TBA
Early-Bird Registration Deadline To be announced TBA
ECWC17 Conference 18–20 August 2027 Confirmed

Partnership opportunities

Position your brand at the centre of the global electronics community

ECWC17 sponsorship provides global brand exposure, access to decision-makers and opportunities to showcase industry leadership through conference, exhibition and networking channels.

ecwc17-logo-light

The 17th Electronic Circuits World Convention,
bringing together the global electronics ecosystem
for knowledge exchange, innovation and collaboration.

Explore

About ECWC17
Technical Topics
Schedule & Program
Presentation Guidelines
Venue & Travel

Conference Secretariat

© 2027 ECWC17. All rights reserved.

Organized by THPCA · Conference powered by MUT · Co-located with THECA 2027