Call for Contributions
Eight technical tracks for the AI-driven future
ECWC17 welcomes technical papers, case studies and industry presentations covering the full spectrum of interconnection technology, manufacturing, reliability, markets and sustainability.
The track structure below is the current proposed framework. Final scope, submission formats and paper templates will be published after approval by the Technical Program Committee.
PCB, HDI & Substrate Technology
- HDI, uHDI, mSAP and SAP
- IC substrate and redistribution layer technologies
- High-layer-count PCB
- Advanced materials, resin systems and copper foils
- Advanced PCB processes and chemistry
Advanced Packaging & Assembly
- 2.5D and 3D packaging
- Chiplet integration
- Power devices and SiC/GaN packaging
- High-reliability assembly
- Solder, interconnect and bonding innovations
Factory of the Future
- Thermal cycling and thermal shock
- CAF, delamination, resin cracking and material reliability
- Via and interconnect reliability
- X-ray, CT and laser inspection
- PCB, EMS and system reliability for AI servers, EV and medical applications
Global Market Outlook & Strategy
- Global PCB and substrate market forecasts
- AI-server supply chains
- EV and ADAS electronics
- China+1 and ASEAN strategy
- Sustainability, PCF and Scope 3 reporting
Emerging Technologies
- Photonics and optical modules
- AI hardware
- Quantum-related electronics
- New interconnection technologies
- Embedded intelligence and fabless ecosystems
Manufacturing Technology & Automation
- Advanced manufacturing processes
- Robotics and automation
- AI-enabled manufacturing and inspection
- Digital twins and smart factories
- Industry 4.0 and connected equipment
Reliability, Quality & Testing
- HALT and HASS
- Failure analysis
- Reliability testing and validation
- Process control
- AI-driven quality systems
Sustainability & Green Electronics
- Carbon reduction
- Sustainable manufacturing
- Circular economy
- Water and waste management
- ESG for electronics
Submission types
Contribute technical knowledge
Authors and industry experts will be invited to submit original technical work, applied research, manufacturing case studies, technology reviews and strategic industry perspectives.
The 17th Electronic Circuits World Convention,
bringing together the global electronics ecosystem
for knowledge exchange, innovation and collaboration.
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